#QP

#QM24

#jrg

#QP

#asic

Semiconductor, semiconductores, procesador, procesadores, silicio, telecomunicaciones, ingeniero, ingenieros, ASIC, diseño VLSI, microelectrónica, electrónica, circuitos integrados, tecnología semiconductora, nodos avanzados, diseño de chips, fabricación de semiconductores, industria de semiconductores, talento semiconductor, empleos semiconductores, Static timing analysis, STA, timing convergence, corner definition, nodos tecnológicos, leading edge, semiconductor technologies, timing signoff, full chip timing closure, tape-out, post-silicon analysis, ASIC Timing analysis, timing corners, timing closure, PPA improvement, timing bottleneck, Mobile, Compute, Automotive, IOT, physical design, CAD, IP teams, Design Technology Teams, Primetime, Tempus, timing ECO tools, RTL to GDS, mixed-signal SoCs, low-power techniques, clock gating, power gating, multi-voltage designs, Python, Perl, TCL, Unix shell, data processing, timing convergence, team player, comunicación, multitasking, IP design, timing sign off.

#QM24

#jrg

#QP

Mechanical design, server rack platforms, outdoor cabinet enclosures, consumer mobile device test platforms, test platforms, product core team, industrial design team, mechanical engineering design team, product mechanical design, detail design, thermal simulations, tooling, fabrication, product testing, manufacturing transition, Geo, USA, India, China, EU, mechanical engineering packaged design, 3D solid modelling, Proe, Creo, PCBs, packaged design, plastic injection molded parts, Die Cast, Sheet metal parts, 3d printed, CNC machined parts, wire harness design, cable harness design, platform electrical interconnects, stack up tolerance analysis, Antenna design, RF, Thermal, ID constraint requirements, form factor designs, heat transfer, electromechanical enclosures, thermal mitigation, electronics packaging, fabrication methods, CNC, Sheetmetal, Plastic Injection molding, Die Casting, 3D printing, electro-mechanical assemblies, top-down solid modelling, 3D database design, mechanical engineering, analysis fundamentals, circuit board assembly layout, connector placement, board design, EMN file creation, EMP file creation, electrical PCB CAD design, 3D CAD tools, CREO, test fixture design, assembly platform fixture design, PDM systems, Agile, BOM, project management, forced-air thermal dissipation, convection thermal dissipation, consumer mobile, test rack, outdoor infrastructure, electro-mechanical platforms, RF teams, antenna teams, baseband teams, EMI regulatory teams, thermal teams, product management teams, system-level mechanical enclosure concepts, component specification, form factor, design tradeoffs, multi-disciplinary team collaboration, analytical simulations, electrical hardware teams, mfg engineering, product requirements, schedule, program budgets, design fundamentals, fabrication fundamentals, procurement fundamentals, CNC parts, injection molded parts, 3d printed parts, die-cast parts, stamped metal parts, project goals, project peers, mfg engineering, program leadership, e-mail communication, virtual meetings, onsite meetings, instant messaging, status reports, presentation slides, product development processes, schedule execution, multitasking, aggressive schedules, dynamic design environment, design reviews, test fixture design integration, assembly, test, English communication, troubleshoot, assembly issues, part quality issues, BSME, Mechanical Engineering.

#QP

Wireless Systems Engineer, integración, optimización, wireless systems, rendimiento, debugging, field tests, OTA, nuevas funcionalidades, equipment suppliers, interoperabilidad, system performance, diseño, capacity estimation, network management, nuevas tecnologías, performance studies, laboratorio, technical documents, white papers, nuevos estándares, Electrical Engineering, 5G-Advanced, 5G, Wi-Fi, LTE-Advanced, data services, protocolos, RTP, TCP, UDP, IP, planning tools, optimization tools, Atoll, iBwave, QXDM, TEMS, Ethereal, Actix, Agilent, R&S, Spirent, PCtel, programación, C, C++, Perl, Python, MATLAB, ML libraries, PyTorch, Keras, Scikit, cellular technologies, operadores, infraestructura, pruebas de campo, proveedores, capacidad de red, documentos técnicos, estudios de rendimiento, tecnologías celulares, servicios de datos, herramientas de planificación, herramientas de optimización, habilidades de programación, librerías ML, inglés conversacional.

#ITSEP24

#QP

#SQ

#Shantal

Emulation Platforms, FPGA Prototyping, Veloce, Palladium, Emulation tools, Synthesis, Place and Route, Constraints, Clocking, System Debug, Waveform generation, Content Debug, SoC Functionality, CPU Core, DSP Core, Multimedia, IO, Peripherals, DDR, Modem, Bus Protocols, synthesizable models, emulation deployment, SoC design, debug skills, Tools, Technology, Flows, pre-silicon prototyping, bus transactors, jtag transactors, memory, LPDDR3, LPDDR4, PCDDR, System Verilog, UVM, JTAG, kernel debuggers, ARM CPU, SoC architectures, ADI, AMBA, ARM v8, digital circuits, scripting, Python, TCL, Computer Engineering, Computer Science, Electrical Engineering, Electronics Engineering, Verilog, Design Verification, ASIC Design.

#QP

#JRG

Intelligent, high potential, learning, DDR interface, JEDEC spec, bus level, transactions, regression testing, PVT testing, Emulation Build Validation, C code, code flow, code manipulation, test iteration, Post-Si test execution, data review, logic design, hardware debug, low level software issues, hardware issues, debug tools, JTAG, kernel debuggers, post-silicon enabling, bring-up, logic analyzer, DDR bus, Tijuana, relocation packages.