Descripción

This position is to work with a global leader company in the design and development of advanced semiconductors, responsible for architectures and platforms that form the core of some of the most innovative devices on the market. Its silicon engineering drives solutions that deliver high performance, energy efficiency, and intelligent integration, complemented by a key role in advancing modern telecommunications through next-generation wireless connectivity technologies. Its solutions are integrated into billions of devices worldwide, offering an ideal professional environment for talent seeking technological impact, innovation, and growth within a global context.

General Summary

The Product Development and Test Engineering group develops test solutions for design validation / characterization (NPI) and production (HVM) test platforms for highly integrated ASICS designed by QCT. Job responsibilities for this position include designing mechanical interfaces within the test platform ecosystem using 3D CAD/CAD modeling software, creating CAD models & drawings for various IC package architectures, and conducting system-level structural and/or conjugate heat transfer analyses, as needed, using ANSYS CFD/FEA analysis software tools.

Minimum Qualifications

• Bachelor’s Degree in Mechanical Engineering or related fields.
• 1+ years’ Mechanical Engineering experience or related work experience.
• Experience using CAD tools (Creo, Solidworks, AutoCAD, etc.).
• Ability to communicate technical understandings and project status clearly.

Preferred Qualifications

• Master's Degree in Mechanical Engineering or related fields.
• 2+ years’ experience in HW engineering design and validation.
• Knowledge of semiconductor test cell technology and operation and associated hardware design experience.
• Solid background in mechanical design, part fabrication techniques, application of geometric tolerancing and dimensioning (GD&T) best practices per ASME Y14.5-2009.
• Proficiency using Creo Parametric 3D modeling CAD software tool utilizing top-down assembly methodologies.
• Solid background in structural mechanics, heat transfer physics, and electronics cooling principles.
• Practical application of ANSYS CAE software tools for conducting thermal, mechanical, or thermomechanical modeling, simulation, and analysis (i.e. Workbench, Mechanical, Spaceclaim, Icepak, Electronics Desktop).
• Experience conducting tolerance stack-up analysis on complex assemblies.
• Familiarity with Agile product life-cycle management tool.
• IC socket design or experience is a plus.