Descripción

We are looking for a Failure Analysis Engineer to perform chip‑level and system‑level failure analysis on semiconductor IC devices. This role focuses on identifying the root cause of failures using advanced electrical and physical analysis tools.

You will work closely with Product Engineering, Design Engineering, Quality, and Foundry teams to troubleshoot issues, isolate defects, and support corrective actions. This position requires strong analytical skills, technical curiosity, and the ability to collaborate across multi‑national and cross‑functional teams.

Key Responsibilities

• Perform failure analysis on complex semiconductor device issues using creative problem‑solving.
• Act as the case owner for multiple devices and investigations.
• Use electrical fault isolation tools, including:
  • Static laser techniques: XIVA, OBIRCH, Photo Emission, Lock‑In Thermal Microscopy.
  • Dynamic laser stimulation and thermal/photonic fault injection.
• Conduct non‑destructive testing using X-ray, C‑SAM, and advanced imaging tools.
• Perform physical failure analysis on modules, packages, and individual ICs, including single‑device destructive analysis.
• Analyze tester datalogs and debug devices using ATE, system‑level testers, and bench setups.
• Use techniques such as mechanical polishing, chemical delayering, SEM inspection, curve tracing, photon/thermal emission, etc.
• Document findings, identify root causes, and deliver clear reports to engineering teams.
• Collaborate with global engineering partners to drive technical resolutions and corrective actions.

Required Skills & Qualifications

• Fast learner with the ability to work independently.
• Strong understanding of:
  • Semiconductor physics.
  • Device behavior and circuit analysis.
  • Wafer fabrication processes.
• Proficiency in electrical and physical FA techniques such as:
  • Mechanical polishing, chemical etching.
  • SEM/EDX, curve trace.
  • Thermal emission, photon emission, OBIRCH/TIVA.
• Familiarity with tester‑interface optical techniques:
  • Soft Defect Localization.
  • Laser Voltage Probing.
  • Frequency mapping.
  • Time‑resolved emission.
• Experience with SEM nano‑probing (EBIC, EBAC, EBIRCH) on planar, SOI, or FinFET technologies.
• Knowledge of SCAN, Memory BIST, RF/Analog circuits.
• Understanding of reliability tests: CDM, HBM, TLP, HTOL, BHAST, Burn‑In, etc.
• Strong communication, organization, and project management skills.
• Ability to work in a laboratory environment.
• Willingness to work flexible hours, including weekend or night shifts.
• Experience with scripting/programming (Python, automation scripts, Power BI, etc.).

Minimum Qualifications

• Bachelor’s degree in Electrical Engineering, Microelectronics, Physics, or related field.
• 0–2 years of hands‑on semiconductor failure analysis or physical/chemical lab experience.

Preferred Qualifications

• Master’s degree in Electrical Engineering, Microelectronics, Physics, or related field.
• 2+ years experience in chip‑level failure analysis.
• Skills in:
  • Automated Test Equipment (ATE).
  • Data analysis.
  • Product reliability and development